Adhesives Technology for Electronic Applications: Materials, by James J. Licari

By James J. Licari

Adhesives are well-known within the manufacture and meeting of digital circuits and items. in most cases, electronics layout engineers and production engineers aren't good versed in adhesives, whereas adhesion chemists have a restricted wisdom of electronics. This ebook bridges those wisdom gaps and turns out to be useful to either teams.

The publication contains chapters overlaying varieties of adhesive, the chemistry on which they're dependent, and their houses, purposes, strategies, standards, and reliability. assurance of toxicity, environmental affects and the regulatory framework make this booklet fairly very important for engineers and executives alike.

The 3rd version has been up to date all through and comprises new sections on nanomaterials, environmental affects and new environmentally pleasant ‘green’ adhesives. information regarding rules and compliance has been introduced absolutely up-to-date.

As good as delivering complete assurance of normal adhesive kinds, Licari explores the newest advancements in fields such as:

• Tamper-proof adhesives for digital safeguard devices.

• Bio-compatible adhesives for implantable clinical devices.

• Electrically conductive adhesives to exchange poisonous tin-lead solders in published circuit meeting - as required via regulatory regimes, e.g. the EU’s limit of dangerous ingredients Directive or RoHS (compliance is needed for all items put on the eu market).

• Nano-fillers in adhesives, used to extend the thermal conductivity of present adhesives for cooling digital devices.

  • A whole advisor for the electronics to adhesive forms, their houses and purposes - this publication is a vital reference for a variety of experts together with electric engineers, adhesion chemists and different engineering professionals.
  • Provides necessities of adhesives for specific makes use of and descriptions the approaches for program and curing - insurance that's of specific profit to layout engineers, who're charged with developing the interface among the adhesive fabric and the microelectronic device.
  • Discusses the respective benefits and obstacles of other adhesives for a various functions, thereby addressing reliability concerns sooner than they ensue and delivering necessary details to either layout engineers and caliber coverage personnel.

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Extra info for Adhesives Technology for Electronic Applications: Materials, Processing, Reliability

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Burkhart A, Grosse M, Nguyen M. Novel snap cure die attach for in-line processing. Solid State Technol, Jun. 1995. 6. Fisher E, Hinerman JB, Dixon D. SMT adhesive deposition: the line to success. Surface Mount Technol, Dec. 2000. Introduction 33 7. Fathi Z, Tucker D, Ahmad I, et al. Innovative curing of high reliability advanced polymeric encapsulants. Proc. NEPCON West, Anaheim, CA; 1998. 8. Zou Y, Harris J, Ahmad I, Tucker D, Fathi Z. Comparison of die level stresses in chip-onboard packages processed with conventional and VFM encapsulant curing, IMAPS.

In addition, with the trend toward eliminating lead in solder pastes, new no-lead solders are being introduced that require even higher reflow temperatures. These high temperatures have also created a new problem for plastic-encapsulated microcircuits (PEMs) where absorbed moisture in the plastic rapidly vaporizes producing stresses and delaminations within the module. This phenomenon is called popcorning because of the crackling sound heard during the reflow step. Since most solder pastes either contain flux or must be used together with flux, the effective cleaning and removal of flux residues has always presented a problem.

1992. 14. Lau JH. Flip Chip Technologies. McGraw-Hill; 1995. 15. Lau JH, ed. Ball Grid Array Technology. McGraw-Hill; 1995. 16. Messner G, Turlik I, Balde JW, Garrou PE. Thin Film Multichip Modules. ISHM Monograph, Int Soc Hybrid Microelecton; 1992. 17. Licari JJ. Multichip Module Design, Fabrication, and Testing. McGraw-Hill; 1995. 18. Brown R. Materials and Processes for Microwave Hybrids. ISHM Monograph, Int Soc Hybrid Microelecton; 1991. 19. Harper CA, Sampson RM, eds. Electronic Materials and Processes Handbook.

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